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Numerical Model for Thermal Stress Analysis of Bi-Layered Pan under Isothermal Loading

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Abstract (2. Language): 
The bi-metal pan improved quality of cooking in comparison with single layer. Although the materials with different coefficients of thermal expansion and stiffness are bonded together cause thermal stress. These stresses deform the body of utensil. In this paper we studied on the body deformation. The numerical solution, Finite Element Method, of thermal stress is carried out for Cu/Ti, Cu/SSt, Al/Ti, Al/SSt, Cu/CrNi and Al/CrNi bi-metal pan. Base on results the Cu/SSt makes minimum body deformation.
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