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AI/Sİ3N4/P-Sİ aygıtının C-V characteristikleri üzerine metal ile yarıiletken kontak arasındaki yalıtkan tabakanın kalınlık etkisi

The thickness effect of insulator layer between the semiconductor and metal contact on C-V characteristics of AI/Sİ3N4/P-Sİ device

Journal Name:

  • Pamukkale Üniversitesi Mühendislik Bilimleri Dergisi

Publication Year:

  • 2017
DOI: 
10.5505/pajes.2016.23911

Key Words:

Keywords (Original Language):

Author NameUniversity of AuthorFaculty of Author
Abstract (2. Language): 
Metal-insulator-semiconductor (MIS) structures have great interest for their good applications in electronic and optoelectronic. Their importance can be attributed that they have storage layer property, capacitance effect and high dielectric constant. For this reason, two samples of Si3N4 layers were deposited with plasma-enhanced chemical vapor deposition (PECVD) technique on p-type Si; first is about 5 nm thickness and the other is about 50 nm. The thicknesses of Si3N4 were adjusted by an ellipsometer. The thickness effect of Si3N4 layers on the Al/Si3N4/p type Si contact was studied with the capacitance-voltage (C-V) and conductance-voltage (G-V) characteristics of the contact at the frequency range from 10 kHz to 1 MHz and applied bias voltage from -5 V to +5 V at room temperature. In each contact having different insulator layers, capacitance values decreased and conductance values increased with increasing frequencies. The interface states (Nss), the effect of series resistance (Rs), barrier height (<Pb) and carrier concentration (Na) were found from the capacitance-voltage (C-V) and conductance-voltage (G-V) measurements and explained in the details. To determine memristor behavior of the Al/Si3N4/p type Si contact, dual C-V and G-V measurements were performed at 500 kHz and the room temperature, and the results were compared for 5 nm and 50 nm thicknesses layers. Consequently, changing of Si3N4 layer thickness influenced properties of the contacts, and these two contacts have memristor behavior and, they can be used and improved as memory devices in the future.
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Abstract (Original Language): 
Metal-Yalıtkan-Yarıiletken (MIS) yapılar elektronik ve optoelektronikteki iyi uygulamalarından büyük ilgiye sahiptirler. Bu yapıların önemi tabaka depolama özelliği, kapasitans etkisi ve yüksek dileketrik sabitlerine sahip olmalarına dayandırılabilir. Bu yüzden Si3N4 tabakalı iki adet numune plazma destekli kimyasal buhar biriktirme (PECVD) yöntemiyle birinin kalınlığı 5 nm diğerinin kalınlığı 50 nm olacak şekilde p-tip Si üzerine büyütüldü. Si3N4 tabakasının kalınlığı bir elipsometreyle kontrol edildi. Al/Si3N4/p tip Si kontağın üzerine Si3N4 tabakasının kalınlık etkisi 10 kHz-1 MHz frekans değerleri için -5 V'tan +5 V voltaj aralığında yapıların kapasitans-voltaj (C-V) ve iletkenlik-voltaj (G-V) karakteristikleri ile oda sıcaklığında araştırıldı. Farklı kalınlığa sahip kontakların her bir durumda kapasitans değerlerinin artan frekansla azaldığı ve iletkenlik değerlerinin arttığı tespit edildi. Ara yüzey durumları (Nss) ve Seri direnç (Rs) etkileri, bariyer yüksekliği (<Pb) ve taşıyıcı yoğunluğu (N„) kapasitans-voltaj (C-V) ve iletkenlik-voltaj (G-V) karakteristikleri karakterizasyonlardan elde edildi ve açıklandı. Ayrıca 5 nm ve 50 nm kalınlık değerindeki tabakalar için 500 kHz frekansta çift yönlü C-V ve G-V karakterizasyonlarından elde edildi ve kıyaslandı. Sonuç olarak, Si3N4 tabakasının kalınlık değişiminin kontakların özelliklerini etkilediği görüldü ve bu kontakların Memrezistör yapısına sahiptirler ve gelecekte hafıza aygıtları için kullanılabilir ve geliştirilebilirler.
FULL TEXT (PDF): 
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